JPS6249984B2 - - Google Patents

Info

Publication number
JPS6249984B2
JPS6249984B2 JP11074980A JP11074980A JPS6249984B2 JP S6249984 B2 JPS6249984 B2 JP S6249984B2 JP 11074980 A JP11074980 A JP 11074980A JP 11074980 A JP11074980 A JP 11074980A JP S6249984 B2 JPS6249984 B2 JP S6249984B2
Authority
JP
Japan
Prior art keywords
circuit board
mounting
resin
circuit
device hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP11074980A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5735362A (en
Inventor
Isao Komine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP11074980A priority Critical patent/JPS5735362A/ja
Publication of JPS5735362A publication Critical patent/JPS5735362A/ja
Publication of JPS6249984B2 publication Critical patent/JPS6249984B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
JP11074980A 1980-08-12 1980-08-12 Structure of circuit substrate Granted JPS5735362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11074980A JPS5735362A (en) 1980-08-12 1980-08-12 Structure of circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11074980A JPS5735362A (en) 1980-08-12 1980-08-12 Structure of circuit substrate

Publications (2)

Publication Number Publication Date
JPS5735362A JPS5735362A (en) 1982-02-25
JPS6249984B2 true JPS6249984B2 (en]) 1987-10-22

Family

ID=14543569

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11074980A Granted JPS5735362A (en) 1980-08-12 1980-08-12 Structure of circuit substrate

Country Status (1)

Country Link
JP (1) JPS5735362A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0263686U (en]) * 1988-11-01 1990-05-14

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4409924A (en) * 1982-07-01 1983-10-18 National Semiconductor Corporation Self-adjusting plating mask
JPS6359593A (ja) * 1986-08-30 1988-03-15 株式会社東芝 携帯可能媒体における実装方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0263686U (en]) * 1988-11-01 1990-05-14

Also Published As

Publication number Publication date
JPS5735362A (en) 1982-02-25

Similar Documents

Publication Publication Date Title
US5359222A (en) TCP type semiconductor device capable of preventing crosstalk
KR100541649B1 (ko) 테이프 배선 기판과 그를 이용한 반도체 칩 패키지
EP0459493A2 (en) A semiconductor device using a lead frame and its manufacturing method
US6319749B1 (en) Lead frame, semiconductor package having the same and method for manufacturing the same
JP2008277647A (ja) 実装構造体及び電子機器
KR920000076B1 (ko) 반도체장치
JPH01179334A (ja) 半導体素子の実装方法
USH1267H (en) Integrated circuit and lead frame assembly
JPS6249984B2 (en])
KR20010106096A (ko) 액정 표시 장치에 반도체 장치를 실장하기 위한 구조 및그 반도체 장치
JP3060020B2 (ja) 電子部品搭載装置の製造方法
US20010022391A1 (en) Substrate for semiconductor device and semiconductor device fabrication using the same
JP3211746B2 (ja) 電子部品の実装構造
JP2661115B2 (ja) Ｉｃカード
JPH0786340A (ja) 半導体素子の接続方法
JPH06203642A (ja) 異方導電性フィルム及びフィルム状配線体
KR970005714B1 (ko) 반도체 장치 및 그 제조 방법
JPH1146053A (ja) 電子部品の実装構造
JPH0430441A (ja) 半導体装置
JPH07239479A (ja) 液晶表示素子
JPH09162353A (ja) ベアチップ薄膜回路素子の実装用配線基板および実装構造
JPH09172037A (ja) 半導体装置およびその製造方法
JPH01205433A (ja) 半導体装置
JPH04245657A (ja) Ｔａｂテープ
JPH0533824B2 (en])